UK telecommunications client
Requirements study and structural integrity assessment of ball grid arrays
Frazer-Nash have expertise in performing structural integrity assessments as well as analysing shock and vibration
Our UK telecommunications client was developing a new radio communications device intended for the Japanese automotive industry. The device consisted of a number of components connected to a printed circuit board (PCB) via ball grid arrays (BGA).
In order to comply with the Japanese quality assurance measures, our client needed to test the crash worthiness of the PCB to a much higher level than is set by current UK guidelines – which only require that a circuit must be able to withstand the shock and impact of being dropped from 1m high.
Frazer-Nash were asked to review the environmental vibration, shock and thermal shock requirements of a standard produced by the Electronic Industries Association of Japan (EIAJ), and compare these with the requirements of British Standards and US Military Standards.